ECP®

Embedded Component Packaging from AT&S

Conclusion

ECP® is AT&S’s solution to the next generation miniaturisation demands of high performance applications and products.

Embedding components within an electronic module offers dramatic benefits:

  • Miniaturization through stacking of electronic components
  • Performance Gains due to the close proximity of vital passive components to the active semiconductor device

Products benefitting from ECP® will be, amongst others, high efficiency power modules, integrated wireless modules, media codecs and high signal integrity applications e.g. sensors and amplifiers.

Just as MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, ECP builds on well proven techniques to create this new class of packages.

Major ECP advantages include:

  • Significant form factor reduction through integration
  • High reliability
  • Thermal management
  • Possibility to integrate EMI shielding
  • CTE matching

Dietmar Drofenik – CEO BU AP

Fabriksgasse 13
A-8700 Leoben
Österreich

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