Embedded Component Packaging from AT&S
ECP® is AT&S’s solution to the next generation miniaturisation demands of high performance applications and products.
Embedding components within an electronic module offers dramatic benefits:
- Miniaturization through stacking of electronic components
- Performance Gains due to the close proximity of vital passive components to the active semiconductor device
Products benefitting from ECP® will be, amongst others, high efficiency power modules, integrated wireless modules, media codecs and high signal integrity applications e.g. sensors and amplifiers.
Just as MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, ECP builds on well proven techniques to create this new class of packages.
Major ECP advantages include:
- Significant form factor reduction through integration
- High reliability
- Thermal management
- Possibility to integrate EMI shielding
- CTE matching
Dietmar Drofenik – CEO BU AP