IMS Insulated Metallic Substrate PCBs

Product Information “IMS Insulated Metallic Substrate PCBs”

In the single side printed circuit board business, AT&S focuses on IMS boards. These are used primarily as heat sinks for LEDs and power components. To enable heat dissipation, the base material used has one side that is an aluminium or copper layer either 1.0mm or 1.6mm thick.

AT&S offers the following special features:

  • ƒƒMaterials with prepreg or thermally conductive resins
  • ƒƒThermal conductivity in the 0.35-8.0 W/(m•K) range
  • ƒƒScored or routed versions
  • ƒƒWhite or black solder resist
  • ƒƒBased on highly reflective aluminium e.g. Alanod®
  • ƒƒSpecial surfaces are possible, such as ceramic surfaces

 Technology Sheet

CapabilitiesStandard ProductionAdvanced Production
Layer Count / TechnologySingle SidedSingle Sided
PCB Thickness Copper0.8 - 1 mm0.8 - 1 mm
PCB Thickness Range1 - 1.6 mm1 - 1.6 mm
MaterialsIMS - Dielectric on Prepreg Basis
IMS - Dielectric on Resin Basis
IMS - Dielectric on Prepreg Basis
IMS - Dielectric on Resin Basis
Copper Thickness18µm / 35µm / 70µm /105µm18µm / 35µm / 70µm /105µm
Min. Line / Spacing150µm / 150µm100µm / 100µm
Soldermask Registration+/- 150µm ( Screen Printing )+/- 100µm ( Photoimageable )
Min. Soldermask Dam150µm100µm
Soldermask ColorGreen / white / black / red / blueGreen / white / black / red / blue
Max. PCB Size580 mm x 470 mm580 mm x 470 mm
Production Panel610 mm x 500 mm
Customized for optimal Utilization
610 mm x 500 mm
Customized for optimal Utilization
Min. Annular Ring150µm100µm
Smallest Drill1.5 mm1.5 mm
Smallest Routing Bit2 mm2 mm
SurfacesOSP / Immersion Tin
Immersion Ni/Au
Immersion Ni/Pd/Au
OSP / Immersion Tin
Immersion Ni/Au
Immersion Ni/Pd/Au
ScoringYesYes
ID PrintWhite / blackWhite / black
Blue Mask & Carbon PrintYesYes