HDI Microvia PCBs

Product Information “HDI Microvia PCBs”

The history of AT&S has been shaped by high density interconnect (HDI) printed circuit boards. In 1997 they were developed for mass production for the nascent mobile phone industry. Since then HDI printed circuit boards have found applications throughout the electronics industry, and their use was given additional impetus by the introduction of BGA/CSP components. AT&S offers the full range of technologies, from 4-layer laser to 6-n-6 HDI multilayer in all thicknesses.

Special technologies offered by AT&S in connection with HDI:

  • Edge plating for shielding and ground connection
  • Copper-filled microvias
  • Stacked and staggered microvias
  • Cavities, countersunk holes or depth milling
  • Solder resist in black, blue, green, etc.
  • Minimum track width and spacing in mass production around 50μm
  • Low-halogen material in standard and high Tg range
  • Low-DK Material for Mobile Devices
  • All recognised printed circuit board industry surfaces available

Technology Sheet

CapabilitiesStandard ProductionAdvanced Production
Layer Count / Technology4 - 20 Layers4 - 24 Layers
PCB Thickness Range0.5 - 2.4 mm0.32 - 2.4 mm
Build Up Technology 1-N-1 / 2-N-2 / 3-N-3 / 4-N-41-N-1 / 2-N-2 / 3-N-3 / 4-N-4 / 5-N-5 / 6-N-6 / 7-N-7
Min. Laser Drill Diameter110µm75µm
Laser TechnologyCO2 Direct Drilling (UV/CO2)CO2 Direct Drilling (UV/CO2)
Materials FR4 / FR4 Halogen reducedFR4 / Taconic / Rogers / Others on Request
Glass Transition Temperature140°C / 150°C / 170°C140°C / 150°C / 170°C / 200°C
Standard Glass Cloth1027 / 106 / 1080 / 2116 / 1501 /76281037 / 106 / 1080 / 2116 / 1501 / 7628 / 1027
Copper Thickness12µm / 18µm / 35µm / 70µm9µm / 12µm / 18µm / 35µm / 70µm / 105µm
Copper Plating Holes20µm (25µm)13µm / 20µm / 25µm
Min. Line / Spacing60µm / 60µm40µm / 40µm
Soldermask Registration+/- 38µm (Photoimageable)+/- 25µm (Photoimageable)
Min. Soldermask Dam70µm60µm
Soldermask ColorGreen / white / black / red / blueGreen / white / black / red / blue
Max. PCB Size575 mm x 500 mm575 mm x 500 mm
Production Panel609,6 mm x 530 mm
609,6 mm x 457,2 mm
609,6 mm x 530 mm
609,6 mm x 457,2 mm
Min. Annular Ring125µm100µm
Smallest Drill0.28 mm0.15 mm
Smallest Routing Bit0.8 mm0.8 mm
SurfacesOSP / Immersion Tin
Immersion NI/Au
Plated Ni/Au
Immersion Ag
OSP / Immersion Tin
Immersion NI/Au
Plated Ni/Au
Immersion Ag
ScoringYesYes
ID PrintWhiteWhite
Blue Mask & Carbon PrintYesYes