HDI Any-Layer PCBs

Product Information “HDI Any-Layer PCBs”

HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, AT&S uses laser-drilled microvias electroplated with copper.

Special technologies used with HDI any-layer printed circuit boards:

  • Edge plating for shielding and ground connection
  • Minimum track width and spacing in mass production around 40μm
  • Stacked microvias (plated copper or filled with conductive paste)
  • Cavities, countersunk holes or depth milling
  • Solder resist in black, blue, green, etc.
  • Low-halogen material in standard and high Tg range
  • Low-DK Material for Mobile Devices
  • All recognised printed circuit board industry surfaces available

Technology Sheet

CapabilitiesStandard ProductionAdvanced Production
Layer Count / Technology4 - 12 Layers4 - 14 Layers
PCB Thickness Range0.3- 1.2 mm0.3 - 1.4 mm
Build up Technology ANY LAYER Microvias Copper filledANY LAYER Microvias Copper filled
Min. Laser Drill Diameter90µm75µm
Laser TechnologyCO2 Direct Drilling (UV/CO2)CO2 Direct Drilling (UV/CO2)
Materials FR4 / FR4 Halogen reducedFR4 / FR4 Halogen reduced
Glass Transition Temperature140°C / 150°C / 170°C140°C / 150°C / 170°C
Standard Glass Cloth1027 / 106 / 1080 / 2116 / 1501 / 76281027 / 1037 / 106 / 1080 / 2116 / 1501 / 7628
Copper Thickness12µm / 18µm9µm / 12µm / 18µm
Copper Plating Holes20µm (25µm)13µm / 20µm / 25µm
Min. Line / Spacing50µm / 50µm40µm / 40µm
Soldermask Registration+/- 38µm (Photoimageable)+/- 25µm (Photoimageable)
Min. Soldermask Dam70µm60µm
Soldermask ColorGreen / white / black / red / blueGreen / white / black / red / blue
Max. PCB Size575 mm x 500 mm575 mm x 500 mm
Production Panel609.6 mm x 530 mm
609.6 mm x 457.2 mm
609.6 mm x 530 mm
609.6 mm x 457.2 mm
Min. Annular Ring125µm100µm
Smallest Drill0.28 mm0.15 mm
Smallest Routing Bit0.8 mm0.8 mm
SurfacesOSP / Immersion Tin
Immersion NI/Au
Plated Ni/Au
Immersion Ag
OSP / Immersion Tin
Immersion NI/Au
Plated Ni/Au
Immersion Ag
ScoringYesYes
ID PrintWhiteWhite
Blue Mask & Carbon PrintYesYes