HSMtec
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With HSMtec we offer a solution that combines the
transport of high current with simultaneous heat dissipation on the PCB. Partly large copper cross-sections are integrated into the PCB at those points where high-current flows and heat is generated. |
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Connection Technology
Using standard ultrasonic bonding technology, copper wires and profiles are joined to terminal faces. | |
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Profile at the connecting point
between inner and outer layers |
Wires between connecting points
on the inner and outer layers |
Advantages of HSMtec
Combination of high current (power electronics) and finest conductor technology (control electronics) on one PCB.
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High current management |
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Thermal management |
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- Reduction of plugs, wires and assembly |
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- Reduction of PCB heating |
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- Realisation of high currents without
additional components (bus bar...) |
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- Improved heat carriage and conduction
in case of electrical power components
& LEDs |
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- Currents up to 400 A |
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- No therm. stress at the soldering joint |
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- High current in extremely small spaces |
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