Integrated optical interconnections
The development of integrated optical signal interconnections represents a quantum leap for the functionality of printed circuit boards. This new technology will allow highly complex product applications, further miniaturisation of printed circuit boards, an increase in the integration density of product features and hence, higher product added value. Printed circuit boards with optical interconnections will be used where applications call either for very high data streams between components, modules or functional units (e.g. backplanes or multiprocessor boards) or for a space-saving design for interconnection paths (e.g. mobile applications).
The production of interconnections using discrete optical waveguides is very complicated, and the complex interconnection technology makes the interconnections correspondingly costly. Due to fact AT&S R&D is developing innovative approaches to integrate an optical interconnection path (E/O-convertor– optical waveguide – O/E-convertor) completely into a multilayer printed circuit board.
The aim of R&D’s IOI project is to structure optical waveguides in a transparent photoresist layer and to generate an interconnection to the electro-optical components.
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Sceme of a PCB with an electro-optical interconnection |
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Cross-section of an optical waveguide bundle |