IMS

Technology:
 - Insulated metallic substrate
 
Materials:
 - Aluminium/insulation/copper

 

Aluminium core thicknes: 
 - 1,5mm Standard (1,0/2,0/3,0mm on request )
 
Isolation thickness:
 - 80 - 160 µm

 

Kupferkaschierungen:
 - 35µm
 - 70µm
 - 105µm

 

Trace width:    
 - 250µm (standard)
 - 200µm (minimum, silkscreen printing)
 - 150µm (photoengraving)

 

Thermal conductivity:
 - 0,5-4 (8)W/m/K
 

 

Dielectric strength:
 - 2 - 5 kV

 

Solder resist mask:
 - UV screen printed lacquer
 - 2 component lacquer
 - Photosensitive lacquers

 

 Surfaces:    
 - Chemical nickel/gold
 - Organic surface protection (OSP)
 - IP-Gold ( Bondable )

 

Counter routing:
 - Milling / Drilling
 - Scoring
 - Stamping / Punching

 

Additional printing:
 - ID print
 - Blue Mask
 
Material Types:
 - Cobritherm / Hitt Plate

 

> Design Rules (coming soon)