HDI Microvia

Technology:
 - HDI circuit boards (Micro Vias)
 
Materials:
 - FR4/special materials
 
Build ups:
 - 1-N-1/2-N-2/3-N-3/4-N-4
                                                             
Special build ups:
 - filled/stacked Micro Vias

 

Number of Layers:
 - 4-18
 
Circuit board thickness:
 - 0,4 - 2,0 mm

 

Copper laminate thickness: 
 - 12µm
 - 18µm
 - 35µm

 

Trace width:
 - 75µm (standard)
 - 60µm (minimum in series)

Minimum drill diameter:
 - 0,2mm
 
Aspect Ratio:
 - 1:6 standard (maximum 1:8)
 
Solder resist mask:
 - photosensitive lacquers

 

Surfaces:
 - Chemical nickel/gold
 - Chemical tin
 - Organic surface protection (OSP)
 - Galvanic nickel/gold
 - OSP + chemical nickel/gold
 
Contour routing:
 - Milling
 - Score/break line milling

Additional printing:
 - Text printing
 - Carbon
 - Plugging

 
> Design Rules (coming soon)