Multilayer

Technology:
 - Multilayer circuit boards
 
Materials:
 - FR4 / special materials
 
Board thickness:
 - 0,4 mm - 3,4 mm

 

Copper laminate thickness:
 - 18µm
 - 35µm
 - 70µm
 - 105µm
 
Trace width:
 - 100µm (standard)
 - 75µm (minimum)

 

Minimum drill diameter:
 - 0,2 mm

Aspect Ratio:
 - 1:12
 
Solder resist mask:
 - Photosensitive lacquers

 

Surfaces:
 - HAL
 - Chemical nickel/gold
 - Chemisch tin
 - Organic surface protection (OSP)
 - Galvanic nickel/gold
 - Carbon (contact surface)

 

Contour routing:
 - Milling
 - Scoring/Break line milling
 
Additional printing:
 - Text printing
 - Coating (Blue Mask)

 
> Design Rules (coming soon)