Europe's no. 1 and worldwide among the leading printed circuit board producersFragebogen

Double Sided: *

Plated through holes Non plated through holes

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Multilayer: *

Standard Core technology Micro Via

Number of Layers

If there are any Micro Vias, please choose one of the following technologies.

Micro Via und Multilayer:

1-n-1
2-n-2
3-n-3
4-n-4
Only Micro Via
Copper filled vias
Stacked vias

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Singlecard:

Dimension [mm] x

Panel:

Dimension [mm] x

Number of cards per panel: *

Scrap cards allowed:

yes no

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Base material: *

FR4 TG Value: Other material:

Halogen free:

yes no

PCB-End thickness [mm]: *

Cu-End thickness: *

35µm 70µm µm

Outer contour:

routing scoring punching

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Surface finish: *

HASL
HASL lead free
Immersion Au (ENIG)
Immersion Sn
OSP / Entek
SIT (immersion Au + OSP)
Other

Galv. Au

yes no

Soldermask:

Probimer 65 Other

Silkscreen:

none Solder side Component side

Tented Vias:

none Solder side Component side

Blue mask:

None Solder side Component side

Additional Print

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min. line width [µm]:

min. line space [µm]:

SMD-Technik:

Solder side Component side

Controlled Impedances:

Outer layer Inner layer

Test coupon for contr. Impedances:

yes no

Mechanical drilling:

Number per single card:

Smallest mechanical end diameter [mm]:

If the board contains Micro Vias, please fill out the field "Micro via" drilling.

Micro via drilling:

Number per single card:

Additional technical features:

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Attachments


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Additional Information

Information: The files will be uploaded and transmitted after sending the inquiry

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Partnumber: *

Annual Quantity:

Batch size (MOQ): *

Lead time:

Expected answer until:

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Company: *

Name: *

Postition:

Street, No.:

ZIP, City: *

Country:

Phone: *

E-mail: *

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Please choose one of the following options for your request:
1. Upload of technical drawings (Gerber Files)	Link

2. Enter the technical detail manually
Build-Up:	Single Sided Link Double Sided Link Multilayer Link