Ultra Mobile

Embedding Technology for Mobile Devices

Utilising ECP® technology as a module packaging architecture for next generation smartphone and tablet gives dramatic improvements in the areas of

Electronic Packaging footprint reduction

Through ECP® the Designer can stack discrete active and passive components, taking advantage of ECP®’s ultra-thin construction to provide class-leading functional density and form factor

Proven reliability

ECP® has demonstrated through numerous third-party and OEM test regimes that its interconnect technology gives stepped change improvement regarding resistance to mechanical shock

Class-leading Integration concep

Above all, ECP® gives dramatic integration potential, utilising the ECP® substrate as a carrier for other system critical components. The result is a small module footprint with significant reduction in supply chain complexity and “ease of use”

ECP® – the Leading Chip Embedding Technology for Mobile Devices