Facts & Figures

ECP® / Advanced Packaging in Figures

  • AT&S Advanced Packaging is located at AT&S’s Corporate Headquarters in Leoben-Hinterberg, Austria
  • Commercial embedded component production started in November 2010
  • The facility occupies 2.000 sqm of high quality production space within the main building
  • The dedicated ECP® Production Fab is fully ESD protected to norm
  • Lithography is executed through maskless processes – ECP® uses digital exposure techniques for all photo-structuring operations
  • AT&S has invested approximately 15 Mio. Euro in to capital equipment to build the Facility to its current capability, with a dynamic investment plan to reach our roadmap and capacity objectives
  • Capacity of single chip ECP® module production is 20 Mio pieces per month
  • The line producing ECP® is accredited to the automotive TS16949 standard
  • Qualification to the ISO 13485 norm for medical compliance is planned
  • AT&S holds 15 patents in the area of embedded component in laminate technology